Compositions and methods for removing organic substances
US8444768B2 · kind B2 · utility
4Cited by
90References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2009 |
| Grant date | May 21, 2013 |
| Priority date | — |
| Expiry date | Apr 15, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/425
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.