Method of cutting substrate
US8444906B2 · kind B2 · utility
53Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2010 |
| Grant date | May 21, 2013 |
| Priority date | — |
| Expiry date | Feb 3, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/321
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A substrate cutting method includes the steps of aligning a panel including two or more substrates, along a cutting line, forming groove lines in the respective substrates of the panel along the cutting line, by oscillating respective ultraviolet UV laser beams along the cutting line, and cutting the panel along the groove lines, by applying force to the panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.