Method for producing patterned materials
US8444907B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2009 |
| Grant date | May 21, 2013 |
| Priority date | — |
| Expiry date | Jun 28, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/192
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A large area patterned film includes a first patterned area; a second patterned area; and a seam joining the first patterned area and the second patterned area, wherein the seam has a width less than about 20 micrometers. A method for tiling patterned areas includes depositing a predetermined thickness of a curable material; contacting a first portion of the curable material with a mold; curing the first portion of the curable material; removing the mold from the cured first portion of the curable material; contacting a second portion of the curable material with the mold, such that the mold contacts a portion of the cured first portion of the curable material; curing the second portion of the curable material; and removing the mold to yield a seam between the cured first portion of the curable material and the cured second portion of the curable material, wherein the seam has a dimension less than about 20 micrometers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.