Thermal interface material with thin transfer film or metallization

US8445102B2 · kind B2 · utility

Assignee

• Laird Technologies, Inc. · US

Inventors

• Jason L. Strader · Cleveland, US
• Mark Wisniewski · Mentor, US
• Karen Bruzda · Cleveland, US
• Michael D. Craig · Painesville, US

Key dates

• Filing date: Sep 4, 2008
• Grant date: May 21, 2013
• Expiry date: Dec 29, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31678
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.