Methods of treating semiconducting materials including melting and cooling
US8445364B2 · kind B2 · utility
2Cited by
4References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2008 |
| Grant date | May 21, 2013 |
| Priority date | — |
| Expiry date | Oct 18, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02546
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for treating semiconducting materials includes providing a semiconducting material having a crystalline structure, pre-heating a portion of the semiconducting material to a temperature less than the melting temperature of the semiconducting material, and then cooling the semiconducting material prior to exposing at least the portion of the semiconducting material to a heat source to create a melt pool, and cooling the semiconducting material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.