Current sensor using leadframe as sensing element
US8446159B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2010 |
| Grant date | May 21, 2013 |
| Priority date | — |
| Expiry date | Jul 18, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A current sensor is disclosed. The current sensor includes a leadframe having a die paddle, a portion of the die paddle being configured as a resistive element through which current can flow, and an integrated circuit (IC) die attached and thermally coupled to the die paddle. The IC die includes a current sensing module configured to measure a voltage drop across the resistive element and convert the voltage drop measurement to a current measurement signal and a temperature compensation module electrically coupled to the current sensing module. The temperature compensation module is configured to adjust the current measurement signal to compensate for temperature-dependent changes in the resistive element. The temperature compensation module includes a temperature-sensitive element, with a portion of the temperature-sensitive element located directly over a portion of the resistive element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.