Flat speaker apparatus with heat dissipating structure and method for heat dissipation of flat speaker
US8447053B2 · kind B2 · utility
2Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2010 |
| Grant date | May 21, 2013 |
| Priority date | — |
| Expiry date | Apr 22, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R19/013
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flat speaker apparatus including a driving circuit module, a flat speaker and a thermally conductive connector, and with a heat dissipating structure is introduced. The flat speaker includes a porous electrode and a vibrating film. The porous electrode causes the vibrating film to vibrate according to an audio signal output from the driving circuit module for generating sound. The thermally conductive connector connects the driving circuit module and the flat speaker to conduct heat from the driving module to the flat speaker for dissipation. A method for heat dissipation of the flat speaker is also introduced herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.