Solder ball loading mask, apparatus and associated methodology
US8448838B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2011 |
| Grant date | May 28, 2013 |
| Priority date | — |
| Expiry date | Dec 9, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0557
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.