Methods of compounding nanoparticles with a resin
US8448885B2 · kind B2 · utility
4Cited by
8References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2009 |
| Grant date | May 28, 2013 |
| Priority date | — |
| Expiry date | Jul 26, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J5/005
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Methods of compounding nanoparticles (e.g., surface-modified silica nanoparticles) with a resin (e.g., a curable resin) are described. The methods use continuous wet milling technology and can be used to compound nanoparticles, including highly aggregated and agglomerated surface-modified nanoparticles, into a resin or resin precursor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.