Cooling method for CXP active optical transceivers
US8449203B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 2, 2010 |
| Grant date | May 28, 2013 |
| Priority date | — |
| Expiry date | Oct 7, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4269
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
CXP is a telecommunications connector standard based on cage assemblies originally designed for copper cables. Optical transceivers dissipate more heat than copper cables, however, so cage assemblies designed for copper cables cannot remove heat adequately for proper transceiver operation. One embodiment of the inventive cage assemblies removes heat from an optical transceiver with a heat spreader, which protrudes through an aperture in a cage, and a compressible gap pad in thermal contact with the heat spreader. Inserting the optical transceiver into the cage places the transceiver in thermal contact with a heat spreader and pushes the heat spreader out of the cage, which, in turn, causes the gap pad to come into thermal contact with a heat pipe and/or a heat sink. The embodiment provide a low mechanical profile to support high-density circuit board configurations for high-density optical connectivity systems, such as used in Dense Wavelength Division optical networking.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.