Seam joining together at least two web materials
US8449519B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2007 |
| Grant date | May 28, 2013 |
| Priority date | — |
| Expiry date | Apr 16, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24777
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A seam joining together at least two web materials in an overlapped manner by ultrasonic welding, heat bonding or the like, in a bonding pattern, which includes comprising a first bonding pattern and at least one second bonding pattern extending in a longitudinal direction along and adjacent at least one side edge of the overlapped portion. The bonded area of the second bonding pattern occupies more than 30% of the combined bonded area of the first and second bonding patterns. The bonding elements of the first bonding pattern have a mean area that is at least 2 times the mean area of the bonding elements of the second bonding pattern. The contact area of the bonding pattern, as seen in transverse direction of the seam, is between 10 and 30% of the width of the bonding pattern at any given point along the length of the bonding pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.