Patent · US Active

Polymer powder comprising polyamide use thereof in a moulding method and moulded body made from said polymer powder

US8449809B2 · kind B2 · utility

6Cited by

22References

19Claims

0Family size

Assignee

EVONIK DEGUSSA GMBH · DE

Inventors

Sylvia Monsheimer · Haltern am See, DE
Franz-Erich Baumann · Schneverdingen, DE
Maik Grebe · Bochum, DE
Joerg Lohmar · Dortmund, DE

Key dates

Filing date	Oct 25, 2011
Grant date	May 28, 2013
Priority date	—
Expiry date	Oct 25, 2031

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB33Y70/10
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A molding, produced by a layer-by-layer process in which regions of respective polymer pulverulent layers are selectively melted via introduction of electromagnetic energy, where the process employs a powder which comprises at least one homopolyamide prepared via polycondensation of diamines and dicarboxylic acids, wherein the homopolyamide has an enthalpy of fusion of at least 125 J/g and a recrystallization temperature of at least 148° C.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.