Suspension board with circuit and production method thereof
US8450613B2 · kind B2 · utility
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1References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2010 |
| Grant date | May 28, 2013 |
| Priority date | — |
| Expiry date | Feb 26, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the insertion portion is larger than a thickness of the insulating cover layer in a portion other than the insertion portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.