Laser machining systems and methods with moving laser scanning stage(s) providing force cancellation
US8450641B2 · kind B2 · utility
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18References
21Claims
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Key dates
| Filing date | Oct 9, 2009 |
| Grant date | May 28, 2013 |
| Priority date | — |
| Expiry date | Dec 2, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/36
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Laser machining systems and methods may use one or more moving laser scanning stages with force cancellation. The force cancellation is provided by moving masses linearly with equal and opposition motion. One or more of the masses may be a laser scanning stage. The laser machining systems may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.