Printed circuit board
US8451615B2 · kind B2 · utility
0Cited by
3References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2011 |
| Grant date | May 28, 2013 |
| Priority date | — |
| Expiry date | Jul 27, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0979
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes a top layer and a bottom layer. A power supply and an electronic component are located on the top layer. The power supply is connected to the top layer and the bottom layer through a first via. A number of second vias extends through the top layer and the bottom layer, and is electrically connected to the top layer and the bottom layer. A right-angled triangular void area without vias defined therein is formed on the printed circuit board, between the second vias and the electronic component. The second vias are arranged on a hypotenuse of the void area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.