Tire system
US8453500B2 · kind B2 · utility
0Cited by
5References
19Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 19, 2011 |
| Grant date | Jun 4, 2013 |
| Priority date | — |
| Expiry date | Sep 6, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T152/10495
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A system for measuring physical parameters of a tire, according to one embodiment of the present invention comprises a sensor layer and a circuit layer. The sensor layer is communicatively coupled to the circuit layer. The sensor layer is configured as a first thin film and embedded in the tire. The sensor layer provides a signal related to a physical parameter of the tire. The circuit layer is configured as a second thin film and embedded in the tire. The circuit layer processes the signal provided by the sensor layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.