Heat dissipation device with heat pipe
US8453714B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 12, 2010 |
| Grant date | Jun 4, 2013 |
| Priority date | — |
| Expiry date | Jan 29, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An exemplary heat dissipation device includes a fin assembly, a heat pipe, and a protective member. The fin assembly includes stacked fins and air passages between fins. Each fin includes a main body, an extending hole defined in the main body, and a flange extending from the main body around the extending hole. The heat pipe is received in the extending holes of the fins and abuts the flanges of the fins. The protective member includes a plurality pairs of elastic arms. Each pair of elastic arms is sandwiched between a free end of the flange of a corresponding fin and the main body of a corresponding adjacent fin to prevent solder associated with the heat pipe from flowing into the corresponding air passage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.