Micro-architected materials for heat sink applications
US8453717B1 · kind B1 · utility
23Cited by
9References
16Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 20, 2009 |
| Grant date | Jun 4, 2013 |
| Priority date | — |
| Expiry date | Apr 3, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat sink comprising a heat spreader attached to a three-dimensional ordered open-cellular microstructure material. The three-dimensional ordered open-cellular microstructure material has dimensions that allow for large surface area to volume ratios. The three-dimensional ordered open-cellular microstructure may be comprised of hollow truss elements and partially filled with a thermally conductive material or a fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.