Patent · US Active

Photosensitive composition

US8455175B2 · kind B2 · utility

0Cited by

18References

9Claims

0Family size

Assignee

Rohm and Haas Electronic Materials LLC · US

Inventors

Mark R. Winkle · Lansdale, US
Jill E. Steeper · Melrose, US
Xiang-Qian Liu · Collegeville, US
Janet Okada-Coakley · Boylston, US
Scott A. Ibbitson · Trappe, US

Key dates

Filing date	Apr 26, 2011
Grant date	Jun 4, 2013
Priority date	—
Expiry date	Apr 26, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/014
WIPO fieldOptics
WIPO sectorInstruments

Abstract

Photoresist compositions and methods suitable for depositing a thick photoresist layer in a single coating application are provided. Such photoresist layers are particularly suitable for use in chip scale packaging, for example, in the formation of metal bumps.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.