Flip-chip photodiode
US8455972B2 · kind B2 · utility
1Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2012 |
| Grant date | Jun 4, 2013 |
| Priority date | — |
| Expiry date | Aug 13, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F55/00
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photodiode is provided according to various embodiments. In some embodiments, the photodiode includes a substrate and an active region. The active region is configured to receive light through the substrate. In such a configuration, the substrate not only participates in the photodiode operation acts as a light filter depending on the substrate material. In some embodiments, the active region may include solder balls that may be used to couple the photodiode to a printed circuit board. In some embodiments, the active region is coupled face-to-face with the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.