Electronic device housing and manufacturing method thereof
US8456812B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 28, 2010 |
| Grant date | Jun 4, 2013 |
| Priority date | — |
| Expiry date | Aug 1, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electronic device housing includes a bottom housing, a support frame, a display panel, and a side frame. The bottom housing includes a base plate and four sidewalls extending from a periphery of the base plate. The support frame is welded to the sidewalls of the bottom housing. The support frame is received in the bottom housing and made up of at least two support plates, two ends of each are welded to ends of the adjacent support plates. The support frame forms at least two welding lines at joints of the at least two support plates, and each welding line corresponds to a middle portion of one sidewall. The display panel is positioned on the support frame sandwiched between the support frame and the side frame. The side frame is connected to a top edge of the bottom housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.