Method for manufacturing a circuit for high temperature and high g-force environments
US8458899B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2011 |
| Grant date | Jun 11, 2013 |
| Priority date | — |
| Expiry date | Sep 19, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2947
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.