Heat sink having heat-dissipating fins of large area and method for manufacturing the same
US8459335B2 · kind B2 · utility
2Cited by
9References
12Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jul 29, 2009 |
| Grant date | Jun 11, 2013 |
| Priority date | — |
| Expiry date | May 15, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49353
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat-dissipating fin of a large area is made of a metallic sheet and has a fin body. An outer edge of one side of the fin body extends to form a sheet-like expanding portion. The expanding portion is bent and overlapped on the fin body to obtain the heat-dissipating fin. A heat sink includes a plurality of heat-dissipating fins and a heat-conducting element, which is formed by means of penetrating the respective heat-dissipating fins with a condensing section of the heat-conducting element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.