Polishing slurry and polishing material using same

US8460414B2 · kind B2 · utility

Assignee

• MITSUI CHEMICALS, INC. · JP

Inventors

• Akinori Etoh · Ichihara, JP
• Setsuko Oike · Yokohama, JP
• Tomokazu Ishizuka · Ichihara, JP
• Shigeharu Fujii · Sodegaura, JP
• Kiyotaka Shindo · Sodegaura, JP

Key dates

• Filing date: Apr 14, 2006
• Grant date: Jun 11, 2013
• Expiry date: Oct 16, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/3212
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

Disclosed is a polishing slurry which enables to suppress damages to an under layer while securing an adequate polishing rate. The polishing slurry contains a resin (A) having an amide group and an organic resin (B).