Producing method of wired circuit board
US8460563B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 4, 2009 |
| Grant date | Jun 11, 2013 |
| Priority date | — |
| Expiry date | Oct 13, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/175
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A producing method of a wired circuit board includes a laminating step of preparing a metal supporting board, forming an insulating base layer on the metal supporting board, forming a conductive layer including a terminal portion and a plating lead continued from the terminal portion on the insulating base layer, and forming an insulating cover layer on the insulating base layer so as to cover the conductive layer, a first etching step of etching the metal supporting board, and then etching the insulating base layer to expose the plating lead from the metal supporting board and the insulating base layer, and a second etching step of etching the exposed plating lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.