Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for manufacturing printed wiring board
US8460852B2 · kind B2 · utility
0Cited by
6References
10Claims
0Family size
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Key dates
| Filing date | Apr 24, 2009 |
| Grant date | Jun 11, 2013 |
| Priority date | — |
| Expiry date | Aug 24, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0045
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizing compound having an ethylenic unsaturated bond in the molecule, (C) a photopolymerization initiator and (D) a polymerization inhibitor, wherein the content of the (D) polymerization inhibitor is 20-100 ppm by mass based on the total solid content of the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.