Photosensitive resin composition, photosensitive element, resist pattern manufacturing method, and printed circuit board manufacturing method
US8460853B2 · kind B2 · utility
2Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2009 |
| Grant date | Jun 11, 2013 |
| Priority date | — |
| Expiry date | Sep 30, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/031
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A photosensitive resin composition comprising a (A) binder polymer, a (B) photopolymerizing compound having ethylenic unsaturated bonds in the molecule, a (C) photopolymerization initiator and a (D) polymerization inhibitor, wherein the (C) photopolymerization initiator comprises an acridine compound, and the content of the (D) polymerization inhibitor is 20-100 ppm by weight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.