Method for encapsulating an electronic arrangement

US8460969B2 · kind B2 · utility

Assignee

• tesa SE · DE

Inventors

• Thorsten Krawinkel · Hamburg, DE
• Klaus Keite-Telgenbüscher · Hamburg, DE
• Jan Ellinger · Hamburg, DE
• Alexander Steen · Bonn, DE

Key dates

• Filing date: Nov 18, 2009
• Grant date: Jun 11, 2013
• Expiry date: Nov 18, 2029

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/2852
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

Method for encapsulating an electronic arrangement against permeates wherein a pressure-sensitive adhesive mass based on butylene block copolymers is applied to and around the areas of the electronic arrangement to be encapsulated.