Orthogonal integrated cleaving device
US8461480B2 · kind B2 · utility
0Cited by
6References
13Claims
0Family size
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Key dates
| Filing date | Nov 30, 2010 |
| Grant date | Jun 11, 2013 |
| Priority date | — |
| Expiry date | Jan 4, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P40/57
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An orthogonal integrated cleaving apparatus and methods of controlling such an apparatus are taught. The cleaving apparatus includes two cleaving devices mounted at right angles with respect to a mount facing a substrate to be processed. The non-metallic and/or brittle substrate is separated along two orthogonal axes without rotating or moving the substrate to a second machine by moving the mount or the substrate along the axes. Each cleaving device laser sequentially heats a surface of the substrate along a respective cutting axis, cools the cut area and then laser re-heats the cut area to form a clean break.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.