Patent · US Active

Semiconductor arrangement

US8461616B2 · kind B2 · utility

8Cited by

6References

13Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Thomas Zeiler · Nittendorf, DE
Reiner Windisch · Nittendorf, DE
Stefan Gruber · Bad Abbach, DE
Markus Kirsch · Altentreptow, DE
Julius Muschaweck · Gauting, DE
Torsten Baade · Regensburg, DE
Herbert Brunner · Sinzing, DE
Steffen Köhler · Bukit Mertajam, MY

Key dates

Filing date	Apr 20, 2009
Grant date	Jun 11, 2013
Priority date	—
Expiry date	Sep 18, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/857
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

According to at least one embodiment of the semiconductor arrangement, the latter comprises a mounting side, at least one optoelectronic semiconductor chip with mutually opposing chip top and bottom, and at least one at least partially radiation-transmissive body with a body bottom, on which the semiconductor chip is mounted such that the chip top faces the body bottom. Moreover, the semiconductor arrangement comprises at least two electrical connection points for electrical contacting of the optoelectronic semiconductor chip, wherein the connection points do not project laterally beyond the body and with their side remote from the semiconductor chip delimit the semiconductor arrangement on the mounting side thereof.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.