Power semiconductor device
US8461645B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2011 |
| Grant date | Jun 11, 2013 |
| Priority date | — |
| Expiry date | Jul 29, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a vertical power semiconductor chip including a semiconductor layer. A first terminal is at a first side of the semiconductor layer and a second terminal is at a second side of the semiconductor layer opposite the first side along a first direction. A drift zone is within the semiconductor layer between the first terminal and the second terminal. The drift zone has, in a central part, a compressive stress of at least 100 MPa along a second direction perpendicular to the first direction. The central part extends from 40% to 60% of an overall extension of the drift zone along the first direction and into a depth of the semiconductor layer of at least 10 μm with respect to at least one of the first side and the second side of the semiconductor layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.