Carbon/epoxy resin composition, and carbon-epoxy dielectric film produced by using the same
US8461662B2 · kind B2 · utility
2Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2010 |
| Grant date | Jun 11, 2013 |
| Priority date | — |
| Expiry date | Nov 23, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/68
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A carbon/epoxy composition includes a bisphenol-based epoxy, an amine-based curing agent, an imidazole-based curing catalyst, and carbon black. A carbon-epoxy dielectric layer is fabricated using a reaction product of the carbon/epoxy composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.