Patent · US Active

Integrated power converter package with die stacking

US8461669B2 · kind B2 · utility

19Cited by

3References

22Claims

0Family size

Assignee

Monolithic Power Systems, Inc. · US

Inventors

Eric Yang · Antioch, US
Jinghai Zhou · Cupertino, US
Hunt Hang Jiang · Saratoga, US

Key dates

Filing date	Sep 20, 2010
Grant date	Jun 11, 2013
Priority date	—
Expiry date	Aug 25, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/30107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit for implementing a switch-mode power converter is disclosed. The integrated circuit comprises at least a first semiconductor die having an electrically quiet surface, a second semiconductor die for controlling the operation of said first semiconductor die stacked on said first semiconductor die having said electrically quiet surface and a lead frame structure for supporting said first semiconductor die and electrically coupling said first and second semiconductor dies to external circuitry.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.