Thin film encapsulation for flat panel display device and method of manufacturing thin film encapsulation structure
US8461760B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2012 |
| Grant date | Jun 11, 2013 |
| Priority date | — |
| Expiry date | Oct 25, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/23
Abstract
Thin film encapsulation for a flat panel display device and a method of manufacturing the thin film encapsulation structure. The thin film encapsulation structure of the flat panel display device includes thin film layers covering a display unit formed on a substrate, wherein the thin film layers comprise a plurality of inorganic layers and a hexamethyldisiloxane (HMDSO) layer interposed between the inorganic layers. Accordingly, as multiple layers of the thin film encapsulation structure may be formed in a single chamber, the manufacturing process may be simplified, and also, as the HMDSO layer, which is flexible, absorbs stresses, a risk of cracks occurring may also be reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.