Device interface board with cavity back for very high frequency applications
US8461855B2 · kind B2 · utility
0Cited by
11References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2009 |
| Grant date | Jun 11, 2013 |
| Priority date | — |
| Expiry date | Sep 15, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2889
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In one embodiment, a device interface board is provided which includes a printed circuit board with a DUT interface structure, such as socket, associated with a DUT side of the printed circuit board. A high frequency connector and electronic component are mounted in a cavity formed in a back side of the printed circuit board. A signal via through the printed circuit board couples the high frequency connector and electronic component with the DUT interface structure. An encapsulating structure may be provided, which covers the cavity while allowing a cable to connect to the high frequency connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.