Per die temperature programming for thermally efficient integrated circuit (IC) operation
US8461895B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Oct 25, 2011 |
| Grant date | Jun 11, 2013 |
| Priority date | — |
| Expiry date | Oct 25, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus to provide per die temperature programming for thermally efficient integrated circuit (IC) operation are described. In some embodiments, the junction temperature of an IC component is determined, e.g., to reduce power consumption and/or improve performance. Other embodiments are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.