Heat sink with surface-formed vapor chamber base
US8462508B2 · kind B2 · utility
12Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2007 |
| Grant date | Jun 11, 2013 |
| Priority date | — |
| Expiry date | Jan 13, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49353
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat sink comprises a vapor chamber base formed in a three-dimensional arrangement that mirrors topology of underlying structures on a substrate upon which the heat sink can be mounted, and at least one fin coupled to the vapor chamber base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.