Compact ejectable component assemblies in electronic devices
US8462514B2 · kind B2 · utility
83Cited by
11References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2008 |
| Grant date | Jun 11, 2013 |
| Priority date | — |
| Expiry date | Dec 7, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M2250/14
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Electronic devices are provided with ejectable component assemblies. The ejectable component assembly may include a tray that can be loaded with one or more removable modules, wafers coupled to circuit boards, cages and retaining plates to assist in retaining the tray within the assembly. The ejectable component assembly may include springs operative to engage detents in the tray to retain the tray in the assembly. The ejectable component assembly may include a tray ejector mechanism for ejecting the tray from the assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.