Overmolded components for implantable medical leads and related methods
US8463399B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2009 |
| Grant date | Jun 11, 2013 |
| Priority date | — |
| Expiry date | Mar 2, 2032 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61N1/05
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The various embodiments disclosed herein relate to medical electrical leads. More specifically, certain embodiments relate to leads having one or more drug-eluting components that are overmolded or otherwise positioned on the lead. Other embodiments relate to leads having one or more patterned surfaces, including some leads with one or more patterned surfaces over which one or more drug-eluting components are positioned. Further implementations relate to leads having one or more overmolded patterned surfaces, including some embodiments in which the overmolded surfaces contain at least one drug-eluting component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.