Cooling systems incorporating heat exchangers and thermoelectric layers
US8464781B2 · kind B2 · utility
32Cited by
320References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2006 |
| Grant date | Jun 18, 2013 |
| Priority date | — |
| Expiry date | Oct 19, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A system for cooling a heat source includes a fluid heat exchanger, a pump, a thermoelectric device and a heat rejector. The thermoelectric device includes a cooling portion and a heating portion. The heat rejector is configured to be in thermal contact with at least a portion of the heating portion of the thermoelectric device. The pump is coupled with the fluid heat exchanger and configured to pass a fluid therethrough. The thermoelectric device is configured along with the heat exchanger in the cooling system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.