Method of cutting target members using a cutting saw device
US8465227B1 · kind B1 · utility
13Cited by
20References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 7, 2012 |
| Grant date | Jun 18, 2013 |
| Priority date | — |
| Expiry date | Feb 7, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/9292
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A diamond wire saw and method provides a frame that includes a clamp that attaches to a target (e.g. piling, beam, tubular), an elongated toothed rack extending away from the mount and target, and a moving portion that carries the diamond wire and motor drives that advance the moving portion toward the target and along the toothed rack while driving the wire around roller guides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.