High-speed memory connector
US8465327B2 · kind B2 · utility
21Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2010 |
| Grant date | Jun 18, 2013 |
| Priority date | — |
| Expiry date | Mar 6, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49208
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Structures, methods, and apparatus that provide sockets or connectors that are capable of operating at high data rates. One example provides a connector that uses a flex board to form a connection between pins of a socket or connector and a printed circuit board. In another example, one or more flex boards are used to provide a signal path between a memory device, such as an SODIMM, and a printed circuit board. Another example provides a stack of wafers, each formed of an insulated material and supporting one or more conductive pins for making an electrical connection between a memory device and a flex board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.