Patent · US Active

Process for the preparation of a shaped substrate for a coated conductor

US8465793B2 · kind B2 · utility

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4References
6Claims
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Key dates

Filing dateJun 3, 2009
Grant dateJun 18, 2013
Priority date
Expiry dateApr 18, 2032

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/24628

Abstract

A process for preparing a shaped substrate suitable in the production of coated conductors which process allows the deformation of a textured substrate onto which a textured buffer layer has been already grown.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.