Encapsulation methods for organic electrical devices
US8466011B2 · kind B2 · utility
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22Claims
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Key dates
| Filing date | Mar 4, 2009 |
| Grant date | Jun 18, 2013 |
| Priority date | — |
| Expiry date | Mar 4, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K50/82
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure provides methods and materials suitable for use as encapsulation barriers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device encapsulated by alternating layers of a silicon-containing bonding material and a ceramic material. The encapsulation methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.