Patent · US Active

Polyamides that resist heat-aging

US8466221B2 · kind B2 · utility

1Cited by

18References

20Claims

0Family size

Assignee

BASF SE

Inventors

Manoranjan Prusty · Mannheim, DE
Maxim Peretolchin · Ludwigshafen, DE
Martin Baumert · Dossenheim, DE

Key dates

Filing date	Mar 8, 2011
Grant date	Jun 18, 2013
Priority date	—
Expiry date	Sep 2, 2031

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L79/04
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Thermoplastic molding compositions, comprising

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.