Latent curing agents, epoxy resin compositions containing the same, sealing materials, and organic EL displays
US8466238B2 · kind B2 · utility
12Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2008 |
| Grant date | Jun 18, 2013 |
| Priority date | — |
| Expiry date | May 28, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/8722
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
The invention aims to provide latent curing agents which exert high low-temperature curing properties when used together with ionically polymerizable compounds and which exhibit high storage stability at room temperature. Latent curing agents for ionically polymerizable compounds which agents each contain a hydroxyl-free amine imide compound having an N—N bond energy of 100 to 210 kJ/mol as determined by B3LYP functional theory method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.