Method for repairing bonded metallic structures
US8466386B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2006 |
| Grant date | Jun 18, 2013 |
| Priority date | — |
| Expiry date | Jan 18, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K11/002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of repairing a bonded metallic structure having a first metallic member bonded to a second metallic member is provided. The method includes the steps of: A) forming a hole in at least one of the first metallic member and second metallic member, wherein said hole is sufficiently configured to receive a slug; B) inserting said slug into said hole; and C) passing electrical current through said slug of sufficient intensity to promote melting at the interface between the first metallic member, second metallic member, and said slug, thereby securing the first metallic member with respect to the second metallic member. Alternately, the method may include: D) positioning said slug near said hole; E) passing electrical current through said slug of sufficient intensity to promote arcing between said slug and the bonded metallic structure; and F) inserting said slug into said hole thereby securing the first metallic member with respect to the second metallic member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.