Laser processing method
US8466387B2 · kind B2 · utility
0Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2009 |
| Grant date | Jun 18, 2013 |
| Priority date | — |
| Expiry date | Apr 20, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a laser processing method, a workpiece is set with respect to a jig having a laser passage hole and a relative position of the jig and the workpiece is determined so that the laser passage hole can face toward a target processing point on the workpiece. Then, laser light is irradiated on the target processing point through the laser passage hole while creating a stream of an inert gas flowing from a peripheral area of the target processing point toward the target processing point and flowing away from the workpiece through the laser passage hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.