Workpiece processing system
US8466388B2 · kind B2 · utility
4Cited by
5References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 6, 2010 |
| Grant date | Jun 18, 2013 |
| Priority date | — |
| Expiry date | Mar 23, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23Q11/0053
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A workpiece processing machine, such as a laser cutting machine, includes a motion unit having an associated drive, a cutting head mounted on the motion unit and configured to deliver a cutting beam, and a suction duct or other form of beam interceptor coupled to the motion unit so that it moves therewith and an opening of the suction duct is positioned below the cutting head during a workpiece processing operation. The machine also includes a frame configured to support the motion unit and defining a movement area of the motion unit, the frame having a beam located generally centrally in the movement area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.