Imaging device, imaging module and method for manufacturing imaging device

US8466529B2 · kind B2 · utility

Assignee

• Kabushiki Kaisha Toshiba · JP

Inventors

• Kazuhiro Suzuki · Kawasaki, JP
• Risako Ueno · Tokyo, JP
• Honam Kwon · Ota, JP
• Koichi Ishii · Kawasaki, JP
• Hideyuki Funaki · Tokyo, JP

Key dates

• Filing date: Mar 18, 2011
• Grant date: Jun 18, 2013
• Expiry date: Jul 27, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/13

Abstract

According to one embodiment, an imaging device includes a substrate, a photodetecting portion, a circuit portion and a through interconnect. The substrate has a first major surface, a second major surface on a side opposite to the first major surface, a recess portion provided on the first major surface and retreated in a first direction going from the first major surface to the second major surface, and a through hole communicating with the first major surface and the second major surface and extending in the first direction. The photodetecting portion is provided above the recess portion and away from the substrate. The circuit portion is electrically connected to the photodetecting portion and provided on the first major surface. The through interconnect is electrically connected to the circuit portion and provided inside the through hole. The recess portion has a first inclined surface. The through hole has a second inclined surface.